Description

The manufacturing of microchips is a complex process that involves numerous steps. In this article, ASML focuses on six key stages: deposition, photoresist coating, lithography, etch, ion implantation, and packaging. The process begins with deposition, where thin films of materials are added to the silicon wafer. A light-sensitive coating called photoresist is then applied before exposure to ultraviolet light during the lithography stage. This step determines the size of the transistors on a chip. During etching, the degraded resist is removed to reveal the intended pattern, while ion implantation alters the electrical conducting properties of part of the pattern. Finally, packaging involves slicing and dicing the wafer into individual chips before placing them onto a substrate for operation.